Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-11-30
2009-12-29
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S622000, C029S874000, C029S884000, C257S773000, C257S775000, C257SE23010, C257SE23012, C257SE23037, C257SE23040, C257SE23145, C174S261000, C361S767000
Reexamination Certificate
active
07638419
ABSTRACT:
Various embodiments include a method of forming an interconnect comprising forming at least two vias in a substrate, forming a conductive pad on a surface of the substrate, forming at least one tapered conductive segment on the surface of the substrate coupled to the conductive pad, wherein only a first via of the at least two vias is formed substantially beneath the conductive pad and is coupled to the conductive pad, a second via of the at least two vias is coupled to the conductive pad by a first one of the at least one tapered conductive segments, the first one of the tapered conductive segments having a first end having a first width and a second end having a second width, the first end being connected to the second via and the second end being connected to the conductive pad, the first width being less than the second width.
REFERENCES:
patent: 3601750 (1971-08-01), Mancini
patent: 3725743 (1973-04-01), Murayama
patent: 4275410 (1981-06-01), Grinberg et al.
patent: 4371744 (1983-02-01), Badet et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5200579 (1993-04-01), Takeuchi
patent: 5258648 (1993-11-01), Lin
patent: 5342999 (1994-08-01), Frei et al.
patent: 5355019 (1994-10-01), Fuchs
patent: 5375042 (1994-12-01), Arima et al.
patent: 5389743 (1995-02-01), Simila et al.
patent: 5528080 (1996-06-01), Goldstein
patent: 5706178 (1998-01-01), Barrow
patent: 5731960 (1998-03-01), Fung
patent: 5753976 (1998-05-01), Harvey
patent: 5875102 (1999-02-01), Barrow
patent: 5883436 (1999-03-01), Sadjadi et al.
patent: 5943212 (1999-08-01), Horiuchi et al.
patent: 6010769 (2000-01-01), Sasaoka et al.
patent: 6020561 (2000-02-01), Ishida et al.
patent: 6040524 (2000-03-01), Kobayashi et al.
patent: 6043986 (2000-03-01), Kondo et al.
patent: 6046901 (2000-04-01), Davis et al.
patent: 6111204 (2000-08-01), Goenka
patent: 6130200 (2000-10-01), Brodbeck et al.
patent: 6162997 (2000-12-01), Memis
patent: 6215372 (2001-04-01), Novak
patent: 6246107 (2001-06-01), Silvestre
patent: 6271481 (2001-08-01), Goenka et al.
patent: 6312791 (2001-11-01), Fasano
patent: 6337805 (2002-01-01), Forbes et al.
patent: 6414248 (2002-07-01), Sundstrom
patent: 7088002 (2006-08-01), Jensen
patent: 7375432 (2008-05-01), Jensen
patent: 2006/0191712 (2006-08-01), Jensen
patent: 19642929 (1997-07-01), None
patent: 19642929 (1997-07-01), None
patent: 19748689 (1999-05-01), None
patent: 19748689 (1999-05-01), None
patent: 2468279 (1981-04-01), None
patent: 09-191184 (1997-07-01), None
patent: 2000-31329 (2000-01-01), None
patent: WO-02063934 (2002-08-01), None
“Advisory Action mailed Dec. 3, 2002 in U.S. Appl. No. 09/740,103”, 3 pgs.
“Amendment and Response mailed Jan. 18, 2002 in U.S. Appl. No. 09/740,103”, 16 pgs.
“Amendment and Response mailed Oct. 21, 2002 in U.S. Appl. No. 09/740,103”, 18 pgs.
“Amendment and Response mailed Sep. 25, 2003 in U.S. Appl. No. 09/740,103”, 14 pgs.
“Appellant's Brief on Appeal mailed Nov. 19, 2004 in U.S. Appl. No. 09/740,103”, 16 pgs.
“U.S. Appl. No. 11/382,450 Notice of Allowance mailed Apr. 30, 2007”, 10 pgs.
“U.S. Appl. No. 11/382,450 Notice of Allowance mailed Aug. 30, 2007”, NOAR,8 pgs.
“European Examination Report mailed Sep. 5,2006 in European Patent Application No. 01998012.7”, 4 pgs.
“Final office action mailed Jun. 19, 2002 in U.S. Appl. No. 09/740,103”, 19 pgs.
“Final office action mailed Dec. 31, 2003 in U.S. Appl. No. 09/740,103”, 18 pgs.
“First Examination Report mailed Feb. 11, 2004 in Indian Patent Application No. 786/KOLNP/2003-K”, 3 pgs.
“First Office Action mailed Jan. 15, 2007 in Japanese Patent Application No. 2002-563748”, 4 pgs.
“First Office Action mailed Jan. 7, 2005 in Chinese Patent Application No. 01822713.9”, 8 pgs.
“International Search Report mailed Jun. 20, 2002 in PCT Application No. PCT/US01/44651”, 5 pgs.
“Non-final office action mailed Mar. 25, 2003 in U.S. Appl. No. 09/740,103”, 20 pgs.
“Non-Final Office Action mailed Dec. 3, 2001 in U.S. Appl. No. 09/740,103”, 9 pgs.
“Notice of allowance mailed Feb. 6, 2006 in U.S. Appl. No. 09/740,103”, 9 pgs.
“Notice of allowance mailed Mar. 9, 2005 in U.S. Appl. No. 09/740,103”, 9 pgs.
“PCT Written Opinion for corresponding PCT Application No. PCT/US01/44651”, (Mar. 15, 2005), 7 pgs.
“Request for Continued Examination mailed Dec. 18, 2002 in U.S. Appl. No. 09/740,103”, 1 pg.
“Request for Continued Examination mailed Jun. 9, 2005 in U.S. Appl. No. 09/740,103”, 6 pgs.
“Response to 2nd Office Action mailed May 3, 2006 in Chinese Patent Application No. 01822713.9”, 12 pgs.
“Response to European Examination Report mailed Jul. 2, 2007 in European Patent Application No. 01998012.7”, 8 pgs.
“Response to First Office Action in Chinese Patent Application No. 01822713.9”, 15 pgs.
“Response to Office Action mailed Aug. 18, 2005 in Korean Patent Application No. 10-2003-7008112”, 22 pgs.
“Response to Substantive Examination Adverse Report mailed Nov. 23, 2005 in Malaysian Patent Application No. PI 20015492”, 33 pgs.
“Second Office Action / Telephone Conversation on Apr. 21, 2006 in Chinese Patent Application No. 01822713.9”, 1 pg.
“Substantive Examination Adverse Report mailed Aug. 24, 2005 in Malaysian Patent Application No. PI 20015492”, 3 pgs.
“Supplemental Notice of Allowability mailed Jun. 15, 2005 in U.S. Appl. No. 09/740,103”, 5 pgs.
“The Examiner's Grounds For Rejection mailed Jun. 21, 2005 in Korean Patent Application No. 10-2003-7008112”, 6 pgs.
Anonymous, “Via Reinforced BGA Land”,Research Disclosure, Disclosure No. 438037, Kenneth Mason Publications, Hampshire, Great Britain,(Oct. 2000), 1749-1750.
“Malaysian Application No. PI 20015492 Examiner's Report to the Registrar under Regulation 27C / 27D”, (Nov. 20, 2007), 2 pgs.
Chambliss Alonzo
Intel Corporation
Schwegman Lundberg & Woessner, P.A.
LandOfFree
Method of fabricating a via attached to a bond pad utilizing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating a via attached to a bond pad utilizing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a via attached to a bond pad utilizing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4061348