Method of fabricating a vertically mountable IC package

Details Method of fabricating a vertically mountable IC package Method of fabricating a vertically mountable IC package

2005-10-14

2009-02-24

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000

Reexamination Certificate

active

07494920

ABSTRACT:
A method of fabricating a vertically mountable integrated circuit (IC) package is presented. An integrated circuit is mounted on a printed circuit board (PCB) and electrically coupled to a bond pad on the PCB. The bond pad is coupled with a via that is embedded in the PCB. The IC, the bond pad, the via, and a portion of the PCB are singulated in order to create a vertically mountable IC package. The via is cut through cross-sectionally during singulation so as to expose a portion of the via and thereby provide a mountable area for the IC package. The IC package may be encapsulated or housed in a dielectric material. In addition, the via may be treated with a preservative or other s-uitable electroless metal plating deposition that prevents oxidation and promotes solderability.

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