Method of fabricating a two-sided die in a four-sided...

Details Method of fabricating a two-sided die in a four-sided... Method of fabricating a two-sided die in a four-sided...

2007-06-28

2011-11-15

Garber, Charles (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S123000, C438S125000, C257SE21506, C257SE23031, C257SE23061

Reexamination Certificate

active

08058099

ABSTRACT:
A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. In embodiments, a semiconductor die having die bond pads along two adjacent edges may be electrically coupled to four sides of a four-sided leadframe. Embodiments relate to lead and no-lead type leadframe.

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U.S. Appl. No. 11/770,066, filed Jun. 28, 2007.
Office Action dated Feb. 1, 2010 in U.S. Appl. No. 11/770,066.
Office Action dated Jun. 8, 2010, U.S. Appl. No. 11/770,066.
Response to Office Action filed Dec. 8, 2010 in U.S. Appl. No. 11/770,066.
Final Office Action mailed Jun. 1, 2011 in U.S. Appl. No. 11/770,066.

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