4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Vani Verma

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Apparatus and method for delamination-resistant, array type...

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate

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High reliability lead frame and packaging technology...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Memory module having interconnected and stacked integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Memory module having interconnected and stacked integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Memory module having interconnected and stacked integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2144181

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