Method of fabricating a two die semiconductor assembly

Details Method of fabricating a two die semiconductor assembly Method of fabricating a two die semiconductor assembly

2003-08-29

2008-05-06

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000

Reexamination Certificate

active

07368320

ABSTRACT:
A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the die paddle, a second semiconductor die secured by a backside thereof to the die paddle, wire bonds extending from the first semiconductor die and the second semiconductor die to lead fingers of the plurality, and an encapsulant extending over the first semiconductor die, the second semiconductor die, the die paddle, the wire bonds and portions of the lead fingers. A method of fabricating the semiconductor die assembly and an electronic system incorporating the semiconductor die assembly are also disclosed.

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