4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Neal Bowen

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Method of fabricating a two die semiconductor assembly

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Two die semiconductor assembly and system including same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3139393

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