Method of fabricating a thin film transistor in which the channe

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

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117 8, 438487, 438486, H01L 21336

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active

059306084

ABSTRACT:
A semiconductor device which is excellent in reliability and electrical characteristics. The semiconductor device is formed on an insulating substrate. A channel region is formed between a source and a drain by the voltage applied to a gate electrode. The channel region, the source, and the drain are fabricated from a semiconductor having a large mobility. The other regions including the portion located under the channel region are fabricated from a semiconductor having a small mobility.

REFERENCES:
patent: 4266986 (1981-05-01), Benton et al.
patent: 4322253 (1982-03-01), Pankove et al.
patent: 4375993 (1983-03-01), MNori et al.
patent: 4514895 (1985-05-01), Nishimura
patent: 4619034 (1986-10-01), Janning
patent: 4719183 (1988-01-01), Maekawa
patent: 4727044 (1988-02-01), Yamazaki
patent: 4743567 (1988-05-01), Pandya et al.
patent: 4768076 (1988-08-01), Aoki et al.
patent: 4769338 (1988-09-01), Ovshinsky et al.
patent: 4775641 (1988-10-01), Duffy et al.
patent: 4799097 (1989-01-01), Szluk et al.
patent: 4885258 (1989-12-01), Ishihara et al.
patent: 4888305 (1989-12-01), Yamazaki et al.
patent: 4916504 (1990-04-01), Nakahara
patent: 4918510 (1990-04-01), Pfiester
patent: 5162239 (1992-11-01), Winer et al.
patent: 5236850 (1993-08-01), Zhang
patent: 5264383 (1993-11-01), Young
patent: 5278093 (1994-01-01), Yonehara
patent: 5313076 (1994-05-01), Yamazaki et al.
patent: 5365080 (1994-11-01), Yamazaki et al.
patent: 5619044 (1997-04-01), Makita et al.
Wolf et al., Silicon Processing for the VLSI Era, vol. 2--Process Integration, Lattice Press, 1990, pp. 75-76.
K. Sera et al., "High Performance TFT's Fabricated by XeCl Excimer Laser Annealing of Hydrogenated Amorphous-Silicon Film", 8093 IEEE Transactions on Electron Devices, vol. 36, No. 12, Dec. 1989, pp. 2868-2872, New York, US.
S. Wolf et al., Silicon Processing for the VLSI Era vol. 1: Process Technology, Lattice Press, Sunset Beach, California, (1986) pp. 175, 178-179.
Excimer Laser Annealing Used To Fabricate Poly-Si TFTs, by T. Sameshima and S. Usui, Sony Corporation Research Center, Yokohama, Japan.

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