Method of fabricating a thin film semiconductor device using an

Details Method of fabricating a thin film semiconductor device using an Method of fabricating a thin film semiconductor device using an

1994-07-12

1996-09-24

Wilczewski, Mary

Fishing, trapping, and vermin destroying

437 41, 437247, H01L 21336, H01L 21324

Patent

active

055590420

ABSTRACT:
A semiconductor device and a method for forming the same. The semiconductor device comprises an insulating or semiconductor substrate, a thermally-contractive insulating film which is formed on said substrate and provided with grooves, and a semiconductor film which is formed on the thermally-contractive insulating film and divided in an islandish form through the grooves. The thermally-contractive insulating film is contracted in a heat process after the semiconductor film is formed.

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patent: 5049968 (1991-09-01), Nakagawa et al.
patent: 5250444 (1993-10-01), Khan et al.
patent: 5254208 (1993-10-01), Zhang

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