Method of fabricating a thermal display device

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

148187, 156657, 156662, 357 50, H01L 21306

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active

041207440

ABSTRACT:
A plurality of silicon elements are arranged in a printing array with the major faces co-planar and the edges interconnected into a monolithic structure by a grid of polycrystalline silicon and silicon dioxide. The silicon dioxide provides an electrical and thermal barrier, and the polycrystalline silicon provides a strong mechanical interconection. In the preferred embodiment, the silicon elements are monocrystalline and contain one or more electrical components for selectively heating the elements.
The method for fabricating the device includes the steps of etching V-shaped grooves in one surface of a silicon slice and then successively growing silicon dioxide and polycrystalline silicon on the etched surface to form a thick slice. The other side of the slice is then lapped away to at least the depth of the silicon dioxide in the grooves and semiconductor elements and conductors formed in and/or on the lapped side. The lapped side is then bonded to a substrate and the polycrystalline silicon and silicon dioxide removed from the surfaces of the elements, but not from the grooves between the elements. The elements are thus part of a monolithic sheet having sufficient structural integrity to withstand thermal fracturing without producing print smearing from element to element.

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patent: 3728179 (1973-04-01), Davidson et al.
patent: 3755012 (1973-08-01), George et al.

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