Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-10-16
2007-10-16
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S118000, C257S619000, C257S623000, C257S724000, C257S777000
Reexamination Certificate
active
11511956
ABSTRACT:
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
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IBM Research Disclosure RD41388 (N.N.), Sep. 1, 1998.
Chew Beng Chye
Lim Thiam Chye
Neo Chee Peng
Pour Cheng Poh
Tan Hock Chuan
Chambliss Alonzo
Micro)n Technology, Inc.
Whyte Hirschboeck Dudek SC
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