Method of fabricating a semiconductor wafer

Details Method of fabricating a semiconductor wafer Method of fabricating a semiconductor wafer

1997-09-10

1999-05-04

Bowers, Charles

Semiconductor device manufacturing: process

Gettering of substrate

205746, C02F 1461

Patent

active

058997318

ABSTRACT:
A method of fabricating a semiconductor wafers, which can prevent metal contamination when alkali etching is used. A semiconductor ingot is cut into wafers. The peripheral portion of the sliced wafers is chamfered. The chamfered wafers are then planarized by lapping. The planarized wafers are alkali etched. The alkali etched wafers are subjected to acid washing by using diluted mixed acid solution. The surface of the acid-washed wafers are then polished. The polished wafers are washed again.

REFERENCES:
patent: 5635053 (1995-10-01), Aoki et al.
Stanley Wolf Silicon Procesing for the VLSI Era Lattice Press pp. 24, 25, 516, 1986.

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