Method of fabricating a semiconductor package

Details Method of fabricating a semiconductor package Method of fabricating a semiconductor package

1998-11-20

2000-11-14

Smith, Matthew

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438123, 438125, 257678, 257666, H01L 2144

Patent

active

061469181

ABSTRACT:
A semiconductor package includes a semiconductor package substrate having a frame type insulator which has a penetrating portion in a center portion of the substrate and a plurality of lead bars exposed to upper and lower surfaces of the insulator, a semiconductor chip on the semicondcutor package substrate, an upper surface of the semiconductor chip being attached to the lead bars, a plurality of pads on a center portion of an upper surface of the semiconductor chip, a plurality of wires respectively connecting the pads with an upper surface of the lead bars, and an upper cover protecting the wires, the pads and an upper surface of the semiconductor chip.

REFERENCES:
patent: 5673479 (1997-10-01), Hawthorne
patent: 5736432 (1998-04-01), Mackessy
patent: 5744382 (1998-04-01), Kitayama et al.
patent: 5776802 (1998-07-01), Ochi et al.
patent: 5963796 (1999-10-01), Kim

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