4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Ju-Hwa Lee

Inventor

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Ball grid array semiconductor package comprised of two lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Integrated chip package with reduced dimensions and leads expose

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Method of fabricating a semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Semiconductor package and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1439074

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