Method of fabricating a semiconductor image pickup device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 50, 437185, H01L 3118

Patent

active

053765583

ABSTRACT:
A method for fabricating a semiconductor image pickup device for detecting a light image includes a step of forming an array of detector elements, each of which generates an electronic signal in response to light incident thereto, and a step of forming a light absorbing layer which is situated to optically isolate each of the detector elements. The array of detector elements in the light absorbing layer can be formed on a substrate. In one embodiment, the light absorbing layer is produced by forming a first layer contacting with each of the detector elements which has a first refractive index, forming a second layer contacting with the first layer which has a second refractive index greater than the first refractive index of the first layer, and forming a metal layer contacting with the second layer. By forming the light absorbing layer in this manner, the array of detecting elements can be optically isolated from each other so that problems such as cross-talk, for example, can be reduced.

REFERENCES:
patent: 4570329 (1986-02-01), Paine et al.
patent: 4766084 (1988-08-01), Bory et al.
patent: 4972244 (1990-11-01), Buffet et al.
patent: 5188970 (1993-02-01), York et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating a semiconductor image pickup device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a semiconductor image pickup device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a semiconductor image pickup device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-918868

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.