Method of fabricating a semiconductor device including a...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S780000, C438S623000, C438S624000

Reexamination Certificate

active

06998356

ABSTRACT:
A method of fabricating a semiconductor device including a silicon-containing dielectric layer is provided. In one embodiment, a silicon-containing material is deposited on a substrate. The deposited material is processed with a reactive agent to react with silicon atoms of the deposited material to form the dielectric layer. The silicon-containing dielectric layer provides for improved or smaller semiconductor devices by reducing leakage and increasing the dielectric constant.

REFERENCES:
patent: 5290736 (1994-03-01), Sato et al.
patent: 5304398 (1994-04-01), Krusell et al.
patent: 5312776 (1994-05-01), Murakami et al.
patent: 5358739 (1994-10-01), Baney et al.
patent: 5525551 (1996-06-01), Ohta
patent: 5567661 (1996-10-01), Niishio et al.
patent: 5814852 (1998-09-01), Sandhu et al.
patent: 5844771 (1998-12-01), Graettinger et al.
patent: 5872696 (1999-02-01), Peters et al.
patent: 5874766 (1999-02-01), Hori
patent: 5882978 (1999-03-01), Srinivasan et al.
patent: 5917571 (1999-06-01), Shimada
patent: 6197628 (2001-03-01), Vaarstra et al.
patent: 6258653 (2001-07-01), Chew et al.
patent: 6291288 (2001-09-01), Huang et al.
patent: 6444584 (2002-09-01), Hsiao
patent: 6686292 (2004-02-01), Yang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating a semiconductor device including a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a semiconductor device including a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a semiconductor device including a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3645657

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.