Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1995-12-21
1997-04-08
Tsai, Jey
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438720, 438669, H01L 2144
Patent
active
056187548
ABSTRACT:
A semiconductor device having an Au electrode is fabricated as follows. As a first step, an insulating film is formed on a semiconductor substrate. As a second step, a contact hole is selectively formed in the insulating film to expose a part of the substrate. As a third step, a barrier metal layer is formed on an entire surface of a resultant structure to bury at least a part of the contact hole and form a barrier metal layer on the insulating film. As a fourth step, an Au layer is selectively formed on the barrier metal layer. As a fifth step, reactive dry etching is performed using the Au layer as a mask and using an etching gas, obtained by adding an O.sub.2 gas to a mixed gas of at least one type of chlorine based gas selected from a group of a chlorine gas and a carbon chloride gas, and at least one type of fluorine based gas selected from a group of a carbon fluoride gas and a carbon hydrogen fluoride gas in such a manner that a flow rate ratio of (O.sub.2):(chlorine based gas):(fluorine based gas) becomes (1):(4 to 24):(1 to 6), thereby the barrier metal layer is etched out.
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NEC Corporation
Tsai Jey
Turner Kevin F.
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