Method of fabricating a semiconductor device having a...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Self-aligned

Reexamination Certificate

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C438S366000, C438S368000, C438S369000, C257SE27030

Reexamination Certificate

active

07338875

ABSTRACT:
Formation of elements of a vertical bipolar transistor is described, in particular a vertical npn transistor formed on a p-type substrate. Accordingly, an improved method not limited by constraints of photolithography, and an ensuing device made by such methods, is described. A temporary spacer (e.g., an oxide spacer) is deposited over a dielectric separation layer. The temporary spacer and dielectric separation layers are then anisotropically etched, forming a dielectric “boot shape” on a lower edge of the dielectric separation layer. An area within this non-photolithographically produced boot region defines an emitter contact window. Since the boot tip is formed through deposition and etching techniques, the emitter window is automatically aligned (i.e., self-aligned) with an underlying base region. Feature sizes are determined by deposition and etching techniques. Consequently, photolithography of small features is eliminated.

REFERENCES:
patent: 5026663 (1991-06-01), Zdebel et al.
patent: 5067002 (1991-11-01), Zdebel et al.
patent: 5512785 (1996-04-01), Haver et al.
Wolf et al. “Silicon Processing for the VLSI Era” 1986, vol. 1, pp. 521-523.

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