Electrical connectors – Candle simulation type
Patent
1997-01-29
1999-11-16
Picardat, Kevin M.
Electrical connectors
Candle simulation type
439111, 439118, H01L 2144
Patent
active
059846992
ABSTRACT:
A lead frame is formed by subjecting a frame base to a forming process, a semiconductor chip is fixed on leads formed in the lead frame and wires are provided in the semiconductor chip, and then a package which accommodates the semiconductor chip is formed; a non-conductive adhesive being provided, before the forming process, on a position on the frame base in which the leads are formed, and unnecessary portions of the frame base and the non-conductive adhesive being removed in the forming process so that the leads having a predetermined configuration and provided with the non-conductive adhesive are formed.
REFERENCES:
patent: 4994411 (1991-02-01), Naito et al.
patent: 5070039 (1991-12-01), Johnson et al.
patent: 5278101 (1994-01-01), Ikenoue
patent: 5612259 (1997-03-01), Okutomo et al.
patent: 5693573 (1997-12-01), Choi
Fujisawa Tetsuya
Hayashida Katsuhiro
Mitobe Kazuhiko
Sato Mitsutaka
Uno Tadashi
Fujitsu Limited
Picardat Kevin M.
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