Method of fabricating a pellicle cover for projection printing s

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156632, 156634, 156645, 156656, 156652, 1566591, 156247, C23F 100, B44C 122, C03C 1500, C03C 2506

Patent

active

045239746

ABSTRACT:
The invention is also directed to a method of fabricating a pellicle cover assembly for use in a projection printing system for forming an image on a radiation sensitive wafer, the method comprising the steps of applying a gold film onto the surface of a wafer, applying a polymer film onto the gold film surface, curing the polymer film, adhering a support ring to the polymer film, cutting through the polymer and gold films between the ring and wafer edges to expose the wafer surface, peeling the ring off the wafer and etching off the gold film.

REFERENCES:
patent: 4058432 (1977-11-01), Schuster-Woldan
patent: 4170512 (1979-10-01), Flanders et al.
patent: 4384919 (1983-05-01), Casey

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