Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2005-04-26
2005-04-26
Norton, Nadine G. (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S704000, C438S719000, C438S723000, C438S753000
Reexamination Certificate
active
06884722
ABSTRACT:
Disclosed is a method of fabricating a polysilicon line, comprising: forming a patterned hard mask layer over a polysilicon layer; patterning the polysilicon layer to provide a hard mask-capped polysilicon line having a first width; and isotropically removing portions of the polysilicon line to a second width.
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Grant Casey J.
Leidy Robert K.
Sharrow Joel M.
International Business Machines - Corporation
Norton Nadine G.
Sabo William D.
Tran Binh X.
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