Method of fabricating a narrow polysilicon line

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Reexamination Certificate

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C438S704000, C438S719000, C438S723000, C438S753000

Reexamination Certificate

active

06884722

ABSTRACT:
Disclosed is a method of fabricating a polysilicon line, comprising: forming a patterned hard mask layer over a polysilicon layer; patterning the polysilicon layer to provide a hard mask-capped polysilicon line having a first width; and isotropically removing portions of the polysilicon line to a second width.

REFERENCES:
patent: 5139904 (1992-08-01), Auda et al.
patent: 5431770 (1995-07-01), Lee et al.
patent: 5942449 (1999-08-01), Meikle
patent: 5965461 (1999-10-01), Yang et al.
patent: 6013570 (2000-01-01), Yu et al.
patent: 6107172 (2000-08-01), Yang et al.
patent: 6316169 (2001-11-01), Vahedi et al.
patent: 6352867 (2002-03-01), Couteau et al.
patent: 6446641 (2002-09-01), Nakatani

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