Method of fabricating a multi-layer structure for detector array

Details Method of fabricating a multi-layer structure for detector array Method of fabricating a multi-layer structure for detector array

1977-11-28

1981-12-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29572, 156634, 1566591, 156901, 250239, 430 22, 430318, 3401463F, C23F 102, H01J 502, G06K 900, H05K 306

Patent

active

043046240

ABSTRACT:
A photo-detector array module is disclosed wherein: (a) the focal plane array of photo-detectors is in electrical contact with thin film conductors supported on thin ceramic layers extending perpendicular to the focal plane, and (b) sub-module structures, each composed of such layers, have complementary shapes (such as O-shaped and "I-shaped") to provide "component wells" for electronics within the three dimensional space defined at one end by the two-dimensional area of the focal plane. In order to fabricate such a module satisfactorily, a method is disclosed in which each unimaged layer (i.e., layer whereon the thin film conductors have not yet been photo-delineated) is individually laminated to the prior structure, and the photo-delineation process on the unimaged layer includes an optical alignment step to insure alignment of the thin film conductors on each layer with those on preceding layers.

REFERENCES:
patent: 3155561 (1964-11-01), Rubens et al.
patent: 3235942 (1966-02-01), Howell et al.
patent: 3963489 (1976-06-01), Cho
patent: 3970990 (1976-07-01), Carson
patent: 4150177 (1979-04-01), Guditz et al.

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