Method of fabricating a misaligned, composite electrical contact

Details Method of fabricating a misaligned, composite electrical contact Method of fabricating a misaligned, composite electrical contact

1980-05-27

1983-04-26

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29591, 156652, 156656, 156664, 156665, 357 71, 427 82, 427 89, 427399, H01L 21283, H01L 21308, H01L 21316

Patent

active

043812155

ABSTRACT:
Disclosed is a method of fabricating an electrical contact to a region which lies at the surface of a semiconductor substrate and is doped opposite thereto. The method includes the steps of forming the combination of a silicide of a noble metal at the surface of the region, a layer of a barrier metal over the silicide, and a patterned conductor on a portion of the barrier metal layer which partly covers the region; etching partway through the portion of the barrier metal which is not covered by the patterned conductor; and thereafter oxidizing to completion, the portion of the barrier metal layer which is not covered by the patterned conductor and which remains after the etching step.

REFERENCES:
patent: 3442701 (1969-05-01), Lepselter
patent: 3663279 (1972-05-01), Lepselter
patent: 3806778 (1974-04-01), Shimakura et al.
patent: 3864217 (1975-02-01), Takahata et al.
patent: 3939047 (1976-02-01), Tsunemitsu et al.
patent: 4141022 (1979-02-01), Sigg et al.
patent: 4172004 (1979-10-01), Alcorn et al.
patent: 4267012 (1981-05-01), Pierce et al.
patent: 4289574 (1981-09-01), Radigan et al.
Hitchner et al. "Chromium . . . Barrier" IBM Technical Disclosure, vol. 22, No. 10 (3/80) p. 4516.

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