Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate
2007-08-21
2007-08-21
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Etching of semiconductor material to produce an article...
C438S053000
Reexamination Certificate
active
11426017
ABSTRACT:
A method of fabricating a diaphragm of a capacitive microphone device. First, a substrate is provided, and a dielectric layer on a first surface of the substrate is formed. Than, a plurality of silicon spacers are formed on a surface of the dielectric layer, and a diaphragm layer is formed on a surface of the silicon spacers and the surface of the dielectric layer. Subsequently, a planarization layer is formed on the diaphragm layer, and a second surface of the substrate is etched to form a plurality of openings corresponding to the diaphragm layer disposed on the surface of the dielectric layer. Thereafter, the dielectric layer exposed through the openings is removed, and planarization layer is removed.
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Culbert Roberts
Hassanzadeh Parviz
Hsu Winston
Touch Micro-System Technology Inc.
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