Method of fabricating a compound semiconductor device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437176, 437245, 437912, H01L 21203

Patent

active

053267176

ABSTRACT:
A method of fabricating a Schottky electrode by the adsorption of thin layer with not more than 10 monolayers of a metal whose oxide is stable on a III-V compound semiconductor substrate such as InP or on a substrate, the surface on which epitaxial layer is grown, and the successive oxidation of the thin metal film is disclosed. Since the generation of dangling bonds at the interface due to the elastic strain between the substrate and the metal oxide can be prevented, it becomes possible to obtain a Schottky electrode with a high Schottky barrier height and thus to fabricate MESFETs and Schottky diodes having good characteristics such as a small reverse leak current and a large break-down voltage.

REFERENCES:
patent: 4845049 (1989-07-01), Sunakawa
patent: 4859627 (1989-08-01), Sunakawa
patent: 5158909 (1992-10-01), Ohtsuka et al.
Licata et al., "Application of Photodeposited Cd to Schottky barrier Diode and Transistor Fabrication on InP and In.sub.0.53 Ga.sub.0.47 As Substrates", in Appl. Phys. Letts., 58(8), Feb. 1991, 845.
Massies et al., "Monocrystalline Alluminium Ohmic Contact to n-GaAs by H.sub.2 S Adsorption", in Appl. Phys. Letts., 38(9), May 1981, 693-695.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating a compound semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a compound semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a compound semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-795801

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.