Method of fabricating a COF utilizing a tapered IC chip and...

Details Method of fabricating a COF utilizing a tapered IC chip and... Method of fabricating a COF utilizing a tapered IC chip and...

2005-01-11

2005-01-11

Chambliss, Alonzo (Department: 2827)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S125000

Reexamination Certificate

active

06841419

ABSTRACT:
A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.

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