Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-05-23
2011-11-22
Arbes, Carl (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S847000, C029S852000
Reexamination Certificate
active
08061024
ABSTRACT:
Provided are a circuit board, a semiconductor package including the circuit board, a method of fabricating the circuit board, and a method of fabricating the semiconductor package. The method of fabricating the circuit board includes: forming at least one pair of rows of first bonding pads arranged on a base substrate in a first direction, and a first central plating line formed between the rows of first bonding pads to commonly connect with the rows of first bonding pads; forming an electroplating layer on the first bonding pads; and exposing the base substrate by removing the first central plating line.
REFERENCES:
patent: 4775573 (1988-10-01), Turek
patent: 4854040 (1989-08-01), Turek
patent: 6753480 (2004-06-01), Maa et al.
patent: 6933448 (2005-08-01), Maa et al.
patent: 2001-148444 (2001-05-01), None
patent: 2004-0110531 (2004-12-01), None
patent: 2006-0108045 (2006-10-01), None
English language abstract of Japanese Publication No. 2001-148444.
English language abstract of Korean Publication No. 2004-0110531.
English language abstract of Korean Publication No. 2006-0108045.
Hur Soon-Yong
Lee Jong-Joo
Arbes Carl
Muir Patent Consulting, PLLC
Samsung Electronics Co,. Ltd.
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