Method of fabricating a circuit board

Details Method of fabricating a circuit board Method of fabricating a circuit board

2006-08-15

2006-08-15

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S833000, C029S852000

Reexamination Certificate

active

07089660

ABSTRACT:
A circuit board with an asymmetrical structure and a method for fabricating the same are proposed. A core circuit board is provided, with a build-up structure being formed on a side of the core circuit board, and a laminated structure being formed on an opposite side of the core circuit board, such that the build-up structure and laminated structure on two sides of the core circuit board can be mutually balanced. Then, the build-up process and the laminated process can be repeated on the two sides of the core circuit board to form more build-up structures and at least one more laminated structure having preferable rigidity to counteract warpage of the core circuit board caused by fabrication of the build-up structures, wherein the number of the build-up structures can be larger than the number of the laminated structures thereby forming a circuit board with an asymmetrical structure.

REFERENCES:
patent: 07066557 (1995-03-01), None
patent: 2003179330 (2003-06-01), None

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