Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2005-08-25
2009-10-27
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S014000, C438S015000, C438S016000, C438S017000, C438S107000, C438S108000, C438S109000
Reexamination Certificate
active
07608469
ABSTRACT:
A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first side portion of the shell and a cavity in a second side portion of the shell. The method may include the step of testing the embedded first electrical part to determine whether the first electrical part is defective or functional. The method may also include the steps of providing a second electrical part, inserting the second electrical part within the cavity of the shell second side portion, establishing electrical communication between the first and second electrical parts if a test result of the first electrical part indicates that the first electrical part is functional, and finishing the chip. Also, the method may include the step of rejecting the first electrical part if the test result of the first electrical part indicates that the first electrical part is defective.
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Au Bac H
Kingston Technology Corporation
Sawyer Law Group P.C.
Smith Zandra
LandOfFree
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