Method of fabricating a cantilever beam for a monolithic acceler

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29580, 29610SG, 73517R, 73720, 73726, 156647, 156653, 156657, 1566591, 156662, 338 2, 338 47, 357 26, 357 55, H01L 21306, B44C 122, C03C 1500, C03C 2506

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046700927

ABSTRACT:
A monolithic accelerometer is fabricated with an integral cantilever beam sensing element which is etched out of a silicon wafer from the back surface. A thermal silicon oxide is formed on both surfaces of a (100) silicon wafer. Silicon oxide is removed from the back surface in a pattern which defines the sides of the cantilever beam and the sides of an alignment groove. The width and orientation of the openings in the silicon oxide are selected to control the depth of etching when the wafer is subsequently etched with an anisotropic etchant. An integrated circuit is then formed on the front surface and dry etching is used to complete the groove and separate the sides of the beam from the wafer.

REFERENCES:
patent: 4071838 (1978-01-01), Block
patent: 4597003 (1986-06-01), Aine et al.
Roylance et al., "A Batch-Fabricated Silicon Accelerometer", IEEE Transactions on Electron Devices, vol. ED-26, No. 12, Dec. 1979, pp. 1911-1917.

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