Method of fabricating a built-in chip type substrate

Details Method of fabricating a built-in chip type substrate Method of fabricating a built-in chip type substrate

2007-07-31

2007-07-31

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE27026

Reexamination Certificate

active

11141421

ABSTRACT:
A method of fabricating a built-in chip type substrate containing a semiconductor chip is disclosed. The method comprises a first step of mounting the semiconductor chip on a substrate; a second step of forming chip connection wiring connected to the semiconductor chip mounted on the substrate; and a step of forming an alignment post on the substrate before the first step, the alignment post being used for positioning the chip connection wiring.

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