Method of fabricating a 3-D package stacking system

Details Method of fabricating a 3-D package stacking system Method of fabricating a 3-D package stacking system

2006-02-14

2008-10-14

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S127000, C257S686000, C257S724000, C257S780000, C361S735000, C361S783000, C361S790000

Reexamination Certificate

active

07435619

ABSTRACT:
The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a lower package, the lower package having the ball grid array package and the substrate encapsulated by a molding compound and attaching a second integrated circuit package over the lower package.

REFERENCES:
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5579207 (1996-11-01), Hayden et al.
patent: 5748452 (1998-05-01), Londa
patent: 5844315 (1998-12-01), Melton et al.
patent: 5854507 (1998-12-01), Miremadi et al.
patent: 5963430 (1999-10-01), Londa
patent: 5982633 (1999-11-01), Jeansonne
patent: 6083775 (2000-07-01), Huang et al.
patent: 6101100 (2000-08-01), Londa
patent: 6165815 (2000-12-01), Ball
patent: 6242932 (2001-06-01), Hembree
patent: 6529027 (2003-03-01), Akram et al.
patent: 6555917 (2003-04-01), Heo
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6774475 (2004-08-01), Blackshear et al.
patent: 6828665 (2004-12-01), Pu et al.
patent: 6838761 (2005-01-01), Karnezos
patent: 6861288 (2005-03-01), Shim et al.
patent: 6891239 (2005-05-01), Anderson et al.
patent: 6916683 (2005-07-01), Stephenson et al.
patent: 6933598 (2005-08-01), Karnezos
patent: 7057269 (2006-06-01), Karnezos
patent: 7093358 (2006-08-01), Akram et al.
patent: 7109574 (2006-09-01), Chiu et al.
patent: 7119427 (2006-10-01), Kim
patent: 7176506 (2007-02-01), Beroz et al.
patent: 7190061 (2007-03-01), Lee
patent: 7355274 (2008-04-01), Lim

Affiliated with

Also associated with

Rating

Method of fabricating a 3-D package stacking system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a 3-D package stacking system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a 3-D package stacking system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3989684