Method of external circuitization of a circuit panel

Details Method of external circuitization of a circuit panel Method of external circuitization of a circuit panel

1991-09-03

1992-10-27

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 1566611, 156666, 156902, B44C 122, C23F 100

Patent

active

051586452

ABSTRACT:
A strippable thin film of Cu is applied above the surface features of a microelectronic circuit package to protect the features during mechanical working, for example drilling, the panel. The thin film is then stripped off of the panel. The thin film may be stripped off of the panel either prior to or after circuitization.

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