Method of exposing wafer using scan-type exposure apparatus

Details Method of exposing wafer using scan-type exposure apparatus Method of exposing wafer using scan-type exposure apparatus

2007-05-08

2007-05-08

Mathews, Alan (Department: 2851)

Photocopying

Projection printing and copying cameras

Methods

C355S053000, C430S311000

Reexamination Certificate

active

10982317

ABSTRACT:
Provided is a method of exposing a wafer using a scan-type exposure apparatus. The method includes scan exposing a first shot selected from a first shot column formed of an array of shots disposed in a row in a first direction. The first shot column may be included in a plurality of shots repeatedly formed in the first direction and a second direction that are substantially orthogonal to each other in an exposure target area on the wafer. The method further includes scan exposing a second shot that is included in a second shot column and disposed in a diagonal direction to the first shot. The second shot column may be formed of an array of shots disposed in a row in the first direction and is closer to the first shot column than any other shot in the plurality of shots.

REFERENCES:
patent: 5483311 (1996-01-01), Sakakibara et al.
patent: 5617182 (1997-04-01), Wakamoto et al.
patent: 6674509 (2004-01-01), Suzuki
patent: 6809798 (2004-10-01), Fujita
patent: 2000-260696 (2000-09-01), None
patent: 2001-230170 (2001-08-01), None
patent: 10-0334852 (2002-04-01), None
English language abstract of the Korean Publication No. 10-0334852.
English language abstract of the Japanese Publication No. 2001-230170.

Affiliated with

Also associated with

Rating

Method of exposing wafer using scan-type exposure apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of exposing wafer using scan-type exposure apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of exposing wafer using scan-type exposure apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3825321