Method of exposing a wafer to a light, and reticle, reticle...

Details Method of exposing a wafer to a light, and reticle, reticle... Method of exposing a wafer to a light, and reticle, reticle...

2007-09-04

2007-09-04

Nguyen, Henry Hung (Department: 2851)

Photocopying

Projection printing and copying cameras

Methods

C355S053000, C430S311000

Reexamination Certificate

active

11023231

ABSTRACT:
A method of exposing a wafer to a light comprises transferring an image onto a plurality of shot areas by irradiating a projection light, each of the plurality of shot areas including at least one die area defined on the wafer on which a photoresist film is formed, and scanning the at least one die area adjacent to an edge portion of the wafer by irradiating a scanning light.

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patent: 03237459 (1991-10-01), None
patent: 2002-33272 (2002-01-01), None
patent: 2001-0098613 (2001-11-01), None

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