Method of exposing a peripheral part of a wafer

Details Method of exposing a peripheral part of a wafer Method of exposing a peripheral part of a wafer

1991-07-22

1993-04-20

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430322, 430327, 430328, 430330, G03F 720

Patent

active

052042243

ABSTRACT:
A method of exposing a peripheral part of the wafer is used for a fine pattern formation process in the processing of ICs, LSIs and other electronic elements, to remove, in a development step, an unnecessary portion of a photoresist coated on a semiconductor substrate, typically a silicon wafer, or a substrate consisting of a dielectric, a metal or an insulator. A peripheral part of the wafer is exposed to light led by an optical fiber light guide. The same area is exposed to light at least twice in a predetermined time interval. The illumination intensity of light in a wavelength range necessary for the first exposure is set to be lower than that for the second and following exposures. In the first exposure, the wafer may be held in a heated state.

REFERENCES:
patent: 4868095 (1989-09-01), Suzuki et al.

Affiliated with

Also associated with

Rating

Method of exposing a peripheral part of a wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of exposing a peripheral part of a wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of exposing a peripheral part of a wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1525405