Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2005-08-09
2005-08-09
Gurley, Lynne A. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C438S016000, C438S017000, C438S466000, C438S672000, C438S675000, C438S685000, C438S705000, C438S745000, C438S754000
Reexamination Certificate
active
06927082
ABSTRACT:
Defective contact plug fills can be detected by applying an etching solution, which in some embodiments preferentially etches in the <111> direction. The etching solution is some embodiments may also produce a characteristic type of undercutting underneath the contact plug fill. Contact plug fills with defects in them have undercutting underneath as a result of the etchant exposure, while defective contact plug fills have no such undercutting. The contact plug fills that are now undercut by etching exposure are unable to dissipate surface charge or surface applied potential and can be detected using voltage contrast methods or conventional electrical testing techniques, for example.
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patent: 2002/0036351 (2002-03-01), Suh et al.
patent: 2002/0168812 (2002-11-01), Oda et al.
Crimmins Timothy F.
Golonzka Oleg
Sivakumar Swaminathan
Gurley Lynne A.
Trop Pruner & Hu P.C.
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