Method of etching sapphire utilizing sulfur hexafluoride

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156613, 156643, 156646, 156655, 156661, 156667, H01L 213 8

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040522512

ABSTRACT:
A process for forming a blind hole having an isosceles trapezoidal cross-section in a sapphire substrate using a sulfur hexafluoride gas etchant and an etch mask of silicon nitride on top of silicon dioxide. A composite of sapphire, silicon dioxide and silicon nitride wherein silicon dioxide is located in between the sapphire and the silicon nitride; and the silicon nitride and silicon dioxide are congruently apertured.

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patent: 3743552 (1973-07-01), Fa
patent: 4008111 (1977-02-01), Rutz
Stinson et al., "Sulfur Hexafluoride Etching Effects on Silicon", J. Electrochemical Society, vol. 123, No. 4, Apr. 1976, pp. 551-555.
Anderson et al., "Etching of SiO Using Plasma", IBM Technical Disclosure Bulletin, vol. 16, No. 6, Nov. 1973, p. 1892.

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