Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-05-03
1994-09-27
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156637, 156639, 156668, 252 795, B44C 122, B29C 3700
Patent
active
053504879
ABSTRACT:
The present invention relates to methods of etching polyimide from a substrate and to the etched substrates prepared according to such methods. In one embodiment, the present invention provides a method of etching polyimide from a substrate, comprising the steps of: providing a basic bath; ultrasonically agitating said basic bath; exposing said substrate containing polyimide to said basic bath; rinsing said substrate with hot water; optionally repeating the aforementioned steps at least once; and recovering an etched substrate. In another embodiment, the present invention provides a method of etching polyimide from a substrate, comprising the steps of: providing a basic bath; exposing said substrate containing polyimide to said basic bath; rinsing said substrate with hot water; maintaining the high loading capacity of said basic bath after exposure of polyimide to said basic bath, comprising cooling at least a portion of said basic bath thereby precipitating particles and separating the particles from said basic bath prior to reuse of said basic bath; and recovering an etched substrate.
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Ameen Thomas J.
Cangelosi Jerome M.
Payak John A.
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