Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-06-01
1990-07-10
Lacey, David L.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156654, 1566591, 156664, 252 745, C23F 100, B44C 122
Patent
active
049405101
ABSTRACT:
A wet chemical etchant for etching chromium films that have been patterned with positive photoresist comprising about 3 to about 9 grams potassium hydroxide per liter of water and about 15 to about 25 grams potassium permanganate per liter of water.
REFERENCES:
patent: 3098043 (1963-07-01), Wendell
patent: 3639185 (1972-02-01), Colom et al.
patent: 3652351 (1972-03-01), Guisti
patent: 3773670 (1973-11-01), Colom et al.
patent: 4042729 (1977-08-01), Polichette et al.
patent: 4294651 (1981-10-01), Ohmura
patent: 4425380 (1984-01-01), Nuzzi et al.
patent: 4430154 (1984-02-01), Stahl et al.
patent: 4480288 (1984-10-01), Gazdik et al.
patent: 4517051 (1985-05-01), Gazdik et al.
patent: 4566939 (1986-01-01), Miller et al.
patent: 4592852 (1986-06-01), Corduvelis et al.
patent: 4601783 (1986-07-01), Krulik
patent: 4601784 (1986-07-01), Krulik
patent: 4629636 (1986-12-01), Courdivelis et al.
patent: 4681654 (1987-07-01), Clementi et al.
patent: 4698124 (1987-10-01), Krulik
Vossen and Kern, Thin Film Processes, Academic Press, New York, N.Y., 1978, p. 408.
Digital Equipment Corporation
Johnson Lori
Lacey David L.
LandOfFree
Method of etching in the presence of positive photoresist does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of etching in the presence of positive photoresist, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of etching in the presence of positive photoresist will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1719514