Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-03-18
1992-11-03
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 20419232, H01L 2100
Patent
active
051604051
ABSTRACT:
Described is an etching method of a diamond film which comprises providing a diamond film in an atmosphere of a gas containing at least oxygen and/or hydrogen and subjecting the diamond film to an irradiation of an electron beam generated by direct current discharge through a pattern of a mask. In this condition, when the diamond film is contacted with the plasma produced by the electron beam in the atmosphere, the unmasked areas are irradiated by the electron beam, and converted to graphite. The graphite is more readily etched by the plasma, so that the diamond film can be etched at a high rate. The etching through a mask ensures a fine etched pattern of the diamond film. In addition, a diamond film with a large area can be etched by this method.
REFERENCES:
patent: 4081314 (1978-03-01), Smith
patent: 4273561 (1981-06-01), Fernandez-Moran
patent: 4452679 (1984-06-01), Dunn et al.
patent: 4496449 (1985-01-01), Rocca et al.
patent: 4891120 (1990-01-01), Setti et al.
patent: 4925701 (1990-05-01), Jansen et al.
patent: 4957591 (1990-09-01), Sato et al.
patent: 4980021 (1990-12-01), Kitamura et al.
Kobashi Koji
Kumagai Kazuo
Miyata Koichi
Miyauchi Shigeaki
Goudreau George
Kabushiki Kaisha Kobe Seiko Sho
Simmons David A.
LandOfFree
Method of etching diamond thin films does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of etching diamond thin films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of etching diamond thin films will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2048262