Method of etching copper and copper alloys

Details Method of etching copper and copper alloys Method of etching copper and copper alloys

1975-10-20

1977-11-15

Van Horn, Charles E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

137 3, 156642, 156666, C23F 100

Patent

active

040584313

ABSTRACT:
A method of etching copper and copper alloys by means of an ammoniacal etching solution containing chloride ions and for regenerating this etching solution during this etching process by adding an ammoniacal compound, for example, in the form of ammonium hydroxide or ammonia gas, as well as hydrochloric acid and water to the etching solution in accordance with continuous measurements of the pH-value and the specific gravity of the etching solution.

REFERENCES:
patent: 3592715 (1971-07-01), Lindstrom
patent: 3705061 (1976-12-01), King
patent: 3753818 (1973-08-01), Poor
patent: 3775202 (1973-11-01), Meek
patent: 3816306 (1974-06-01), Roy
patent: 3933544 (1976-01-01), Haas
patent: 3951711 (1976-04-01), Snyder

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