Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1992-06-03
1994-05-03
Kight, III, John
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430314, 430317, 430323, 156643, 156646, 156653, 156654, 156657, G03C 500
Patent
active
053087429
ABSTRACT:
A polyimide layer used in manufacturing semiconductor integrated circuits is etched in a plasma comprising O.sub.2, Ar, and CHF.sub.3. The plasma produces excellent critical dimension control and yields good resist to polyimide etching selectivity.
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Plasma Chemistry and Plasma Processing, vol. 6, No. 4, by Kogoma et al., Mar. 10, 1986, pp. 349-380.
Patent Application, "Integrated Circuit Fabrication Process Using a Bilayer Resist," by Messrs. Cuthbert, Fu, Olasupo Ser. No. 07/708,956, filed May 31, 1991, pp. 1-9.
AT&T Bell Laboratories
Kight III John
Laumann Richard D.
Truong Duc
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