Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-05-27
1989-06-13
Schor, Kenneth M.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156641, 156646, 156665, 252 793, 20419235, C03C 1500
Patent
active
048389927
ABSTRACT:
A plasma etching technique for producing tapered side walls on the desired Aluminum conductor pattern is described. This involves forming a resist pattern on the Aluminum layer of a wafer and carrying out a first etching step using Cl.sub.2, BCl.sub.3 and CF.sub.4 at predetermined flow rates and low pressure until all the exposed Aluminum is removed. At the end of this step the Aluminum side walls are virtually vertical and facets are present on the resist. A second etching step is carried out under essentially the same conditions as before except that the Cl.sub.2 is reduced. During this etching step the facets on the resist are propagated laterally while the Aluminum side walls become tapered. According to modifications a rounded or jogged configuration can be obtained on the side walls but these too are considered generally tapered in nature as they progress from a wider base to a narrower peak.
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Johnson L.
Northern Telecom Limited
Schor Kenneth M.
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