Method of estimating wiring complexity degree in...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000

Reexamination Certificate

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11299757

ABSTRACT:
A method of estimating a wiring complexity degree in a semiconductor integrated circuit with a multi-layered wiring, which has a wiring structure including at least two layers or more, in laying signal wirings, includes a step of predicting a power-supply wiring space used in the semiconductor integrated circuit, a step of dividing the predicted power-supply wiring space onto respective wiring layers, and a step of estimating a complexity degree at a time of laying signal wirings, based on the predicted power-supply wiring space and a wiring specification in respective wiring layers every wiring layer.

REFERENCES:
patent: 6182271 (2001-01-01), Yahagi et al.
patent: 7114140 (2006-09-01), Ishikura
patent: 7155684 (2006-12-01), Kusumoto
patent: 2003/0051218 (2003-03-01), Kumagai
patent: 2004/0031004 (2004-02-01), Yoshioka
patent: 05-174091 (1993-07-01), None
patent: 09-045776 (1997-02-01), None
patent: 10-261719 (1998-09-01), None

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