Method of enhancing connection strength for suspended...

Details Method of enhancing connection strength for suspended... Method of enhancing connection strength for suspended...

2007-09-04

2007-09-04

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S053000, C438S057000, C257SE21001

Reexamination Certificate

active

10980226

ABSTRACT:
A method to enhance the connection strength of suspended membrane leads and substrate contacts is described. A reading circuit chip is provided and a sacrificial layer is formed thereon. Subsequently, an electrical contact window is created in the sacrificial layer to expose a conductive layer of the reading circuit chip. A metal layer is filled into the contact window and a conductive membrane is formed thereon to couple electrically to the metal layer. Afterward, an infrared measuring membrane and an upper dielectric layer are formed thereon.

REFERENCES:
patent: 5521123 (1996-05-01), Komatsu et al.
patent: 6465784 (2002-10-01), Kimata
patent: 6552344 (2003-04-01), Sone et al.

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