Method of endpoint detection and structure therefor

Details Method of endpoint detection and structure therefor Method of endpoint detection and structure therefor

1990-09-05

1993-03-02

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156668, 156345, 20419233, 20429832, 356357, H01L 2100, G01B 902

Patent

active

051906147

ABSTRACT:
Methods and apparatus for enhancing the accuracy for detecting the endpoint of certain operations (such as etching, photoresist development or chemical reaction) in the processing of materials which results in a change in the reflectivity or refractive index of the material are provided. The methods decrease the sensitivity of endpoint detection to high frequency noise and periodic oscillations. The methods also allow accurate calculation of overprocessing time and real-time viewing of data by the user.

REFERENCES:
patent: 4454001 (1984-06-01), Sternheim et al.
patent: 4462860 (1984-07-01), Szmanda
patent: 4569717 (1986-02-01), Ohgami et al.
patent: 4842410 (1989-06-01), Darrah et al.
patent: 5081796 (1992-01-01), Schultz
Xinix Model 2200 Instruction Manual, Revision Feb. 1990, Copyright Mar. 1990 (entire manual).

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