Method of encapsulating conductors

Details Method of encapsulating conductors Method of encapsulating conductors

1988-06-22

1989-05-16

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419215, 204298, 427282, 118505, C23C 1434, C23C 1424

Patent

active

048307238

ABSTRACT:
A method of forming successive metal layers of varying widths on a substrate is disclosed. A mask having a through going aperture is provided, the mask including a constricted neck portion between its upper and lower surfaces. Successive metal layers are applied over the substrate through the aperture in the mask sequentially by sputtering methods which form a metallic layer wider than the constricted neck portion of the mask and by vapor deposition method which forms a narrower metal layer corresponding to the transverse dimension of the constricted portion of the mask.

REFERENCES:
patent: 4561954 (1985-12-01), Scrantom et al.
patent: 4741077 (1988-05-01), Langlois

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