Method of enabling solder deposition on a substrate and...

Details Method of enabling solder deposition on a substrate and... Method of enabling solder deposition on a substrate and...

2009-04-30

2010-11-02

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C438S618000, C438S623000, C438S637000, C438S642000, C257SE23021

Reexamination Certificate

active

07825022

ABSTRACT:
An electronic package includes a substrate (110, 310, 510) and a solder resist layer (120, 320, 520) over the substrate. The solder resist layer has a plurality of solder resist openings (121, 321, 521) therein. The electronic package further includes a finish layer (130, 330, 535) in the solder resist openings, an electrically conducting layer (140, 440) in the solder resist openings over the finish layer, and a solder material (150, 810) in the solder resist openings over the electrically conducting layer. The electrically conducting layer electrically connects the solder resist openings in order to enable the electrokinetic deposition of the solder material.

REFERENCES:
patent: 7413771 (2008-08-01), Arora et al.
patent: 7413805 (2008-08-01), Khaselev et al.
patent: 7678255 (2010-03-01), Khaselev et al.

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