Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-01-04
1990-08-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156653, 156656, 156657, 1566591, 156668, 20419237, 357 71, 437192, 437194, B44C 122, C03C 1500, C03C 2506, C23F 102
Patent
active
049484591
ABSTRACT:
A method of enabling electrical connection to a substructure (10) forming part of an electronic device, such as an integrated circuit, is described in which an aluminum-containing electrically conductive level (1) is provided on a surface (12) of the substructure (10), an insulating layer (2) is deposited so as to cover the aluminum-containing electrically conductive level (1), a photosensitive resist layer (3) is provided on the insulating layer and a plasma etching step is then used to etch away insulating material so as to expose an electrically conductive surface to enable electrical connection to be made to the level (1). The insulating material (2) may be etched through a window in the resist layer (3) so as to form a via (14) or the resist layer (3) and insulating material (2) may be etched uniformly to provide a planarized surface. In the method, a layer (4) of another conductive material which is free of aluminum is provided on the level (1) prior to covering the level (1) with insulating material (2) so that the plasma etching step exposes an electrically conductive surface (4a) of the layer (4) of the said other conductive material which thus acts to mask the level (1) to prevent catalytic reaction between the aluminum and constituents in the plasma.
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Sirkin et al., "A Method of Forming Contacts Between Two Conducting Layers Separated by a Dielectric", Journal of Electrochemical Society: Solid-State Science and Technology, vol. 131, No. 1, Jan. 1984, pp. 123-125.
De Bruin Leendert
van Arendonk Anton P. M.
van Laarhoven Josephus M. F. G.
Miller Paul R.
Powell William A.
U.S. Philips Corporation
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