Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-04-25
2006-04-25
Geyer, Scott (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
Reexamination Certificate
active
07033862
ABSTRACT:
A method of embedding a semiconductor element in a carrier and an embedded structure thereof are proposed. First, a carrier having a hole is provided and an auxiliary material is attached to a side of the carrier. A semiconductor element is placed in the hole of the carrier. Then, a medium material and glue are applied in order in the hole to firmly position the semiconductor element in the hole of the carrier via the glue. Finally, the auxiliary material and the medium material are removed to form a structure with the semiconductor element being embedded in the carrier, thereby eliminating the drawbacks encountered in packing the semiconductor element in the prior art.
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Clark & Brody
Geyer Scott
Nixon William F.
Phoenix Precision Technology Corporation
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